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Industry related knowledge

• Suction nozzle on mounting head

The end of the mounting head of the mounting machine has a mounting tool controlled by a vacuum pump, that is, the suction nozzle. Components of different shapes and sizes are often picked up with different suction nozzles. after the vacuum is generated, the negative pressure of the suction nozzle draws the SMD components from the feeding system (bulk bin, tubular hopper, disc paper tape or tray packing). the suction nozzle must reach a certain vacuum degree in order to judge whether the pick-up components are normal. When the component side stand or because the component "clip tape" can not be sucked up, the placement machine will send an alarm signal. A mounting head suction nozzle picks up the components and places them on a PCB moment, usually using two methods. One is according to the height of the component, that is, input the thickness of the component in advance, when the patch head drops to this height, the vacuum releases and puts the component sticker on the pad. Because of the individual differences of components or PCB, this method can cause premature or too late placement, which can cause component shift or flying defect. Another more advanced method is based on the reaction of components and PCB contact moment, under the action of pressure sensor to achieve the soft landing, so the patch is easy, not easy to appear shift and flying chip defects.
the suction nozzle is the component that directly contacts the components. in order to adapt to the mounting of different components, many placement machines are still equipped with a device to replace the suction nozzle. there is also a buffer mechanism of elastic compensation between the suction nozzle and the suction pipe, which ensures the protection of the patch components during the picking process.
The suction nozzle is in contact with the components in high speed motion, and its wear is very serious, so the material and structure of the suction nozzle are paid more and more attention. Early use of alloy materials, and then changed to carbon fiber wear-resistant plastic materials, more advanced suction nozzle using ceramic materials and diamond, so that the suction nozzle more durable.
With the miniaturization of the components, and the gap with the surrounding components is also decreasing, the structure of the suction nozzle is adjusted accordingly. Open a hole in the suction nozzle to ensure that in the absorption of small components such as 0603 to maintain balance, suction and mount without affecting the peripheral components, easy to mount.

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Name:Brynn
Email :Brynn@eton-mounter.com
WeChat:13802252825
Telephone:138 0225 2825